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Telink TL3 Series

Telink TL3 Series

TL3 Series

Key Hardware & Protocol Features

  • Matter over Thread support
  • Bluetooth Low Energy 5.4
  • Ultra-low power multi-protocol SoC
  • RISC-V core architecture

Telink Micro LLC Corporate DNA & Headquarters

Full Brand Portfolio (4.1/5) →
Parent Company Shanghai Telink Semiconductor Co., Ltd.
Headquarters Location China
Corporate Structure Public (SSE: 688916)

Linked CSA Certification Records

Telink TL3 Series - CSA-IOT

Certificate ID: telink-tl3-series • Date: 05/01/2026 • Thread, Bluetooth

Official CSA Registry →

Ecosystem Strengths

Offers highly cost-effective, ultra-low-power SoCs with robust multi-protocol support including Matter, Thread, Zigbee, and Bluetooth LE.

Considerations

Developer ecosystem and documentation can be challenging to navigate compared to competitors like Nordic Semiconductor or Espressif.