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TeLink Micro Telink TLSR9118

TeLink Micro Telink TLSR9118

TeLink Micro Series

Key Hardware & Protocol Features

  • Matter Certified low-power multiprotocol wireless chip platform
  • Supports concurrent Matter-over-Thread and Bluetooth LE connectivity
  • Optimized for ultra-fast wake-up and low power standby profiles
  • Designed for connected smart sensors, switches, and remote controls

TeLink Micro Corporate DNA & Headquarters

Full Brand Portfolio (4.3/5) →
Parent Company Telink Semiconductor (Shanghai) Co., Ltd.
Headquarters Location China
Corporate Structure Public (SHA: 688591)

Linked CSA Certification Records

Telink TLSR9118 - CSA-IOT

Certificate ID: telink-tlsr9118 • Date: 07/18/2025 • Wi-Fi, Bluetooth

Official CSA Registry →

Ecosystem Strengths

Highly competitive, ultra-low-power multiprotocol SoCs enabling Matter over Thread, BLE, and Zigbee device manufacturing.

Considerations

Semiconductor-level supplier requiring technical engineering expertise, lacking direct-to-consumer smart devices.